我可以嘗試用英文版跟台灣版來測試一次。
測試後再來回覆。
另外, 限制了CPU之後, 暫時沒再出現audiodg.exe或audioeng.dll的問題。(測試約8小時)
現在再加兩個HT/CPU看看會不會有問題。
以下是在 事件檢視器(Event Viewer) 找到的錯誤資料:
失敗的應用程式名稱: AUDIODG.EXE,版本: 10.0.16299.125,時間戳記: 0x71a5988e
失敗的模組名稱: audioeng.dll,版本: 10.0.16299.125,時間戳記: 0xeae3a85f
例外狀況代碼: 0xc0000005
錯誤位移: 0x0000000000031d50
失敗的處理程序識別碼: 0x2868
失敗的應用程式開始時間: 0x01d393dd0519dfb2
失敗的應用程式路徑: C:\Windows\system32\AUDIODG.EXE
失敗的模組路徑: C:\Windows\System32\audioeng.dll
報告識別碼: a3432410-7d4f-4414-9077-7be97d569902
失敗的套件完整名稱:
失敗的套件相關應用程式識別碼:
失敗的應用程式名稱: AUDIODG.EXE,版本: 10.0.16299.125,時間戳記: 0x71a5988e
失敗的模組名稱: audioeng.dll,版本: 10.0.16299.125,時間戳記: 0xeae3a85f
例外狀況代碼: 0xc0000005
錯誤位移: 0x0000000000031d50
失敗的處理程序識別碼: 0x2868
失敗的應用程式開始時間: 0x01d393dd0519dfb2
失敗的應用程式路徑: C:\Windows\system32\AUDIODG.EXE
失敗的模組路徑: C:\Windows\System32\audioeng.dll
報告識別碼: a3432410-7d4f-4414-9077-7be97d569902
失敗的套件完整名稱:
失敗的套件相關應用程式識別碼:
Windows Audio Device Graph Isolation 處理 (audiodg.exe) 已經意外中止。
處理結束代碼 : 0x0xC0000005
=================================================
已知情況:
大概每12分鐘左右,失去聲音,之後AUDIODG.EXE會再自行啟動。
已嘗試:
請問有什麼解決方法?
鎖定的問題。 此問題已從 Microsoft 支援服務社群移轉。 您可以對其是否有幫助進行投票,但無法對問題新增註解或回覆,或進行追蹤。
Audio Device Graph Isolation eats up memory
但是你已經做過了那麼多的動作與重裝Windows 10
或許需考慮硬體故障引起.
更具體地說,這些 AudioEng.dll 錯誤是由於:
- 無效的或損壞的 AudioEng.dll 登錄項目。- 已經損壞了 AudioEng.dll 檔案的病毒或惡意程式碼感染。- Microsoft 硬體失敗,如某個壞的硬碟損壞了 AudioEng.dll 檔案。- 另一個程式覆寫了 AudioEng.dll 所需版本。- 另一個程式惡意地或錯誤地刪除了 AudioEng.dll 檔案。- 另一個程式解除了 AudioEng.dll 檔案安裝。
Windows 10 1709 下載位置?
> https://www.microsoft.com/zh-hk/software-download/windows10
官方提供的Media Creation Tool
硬體廠牌規格:
RAM全部為同一品牌, Part Number 也是一樣
RAMMon v1.0 Build: 1016 built with SysInfo v1.0 Build: 1121
PassMark (R) Software - www.passmark.com
Memory Summary For DESKTOP-QKUGI16
Number of Memory Devices: 4 Total Physical Memory: 32678 MB (32768 MB)
Total Available Physical Memory: 19255 MB
Memory Load: 41%
| Item | Slot #1 | Slot #2 | Slot #3 | Slot #4 | Slot #5 | Slot #6 | Slot #7 | Slot #8 |
|---|---|---|---|---|---|---|---|---|
| Ram Type | DDR4 | DDR4 | DDR4 | DDR4 | Not Populated | Not Populated | Not Populated | Not Populated |
| Maximum Clock Speed (MHz) | 1067 (JEDEC) | 1067 (JEDEC) | 1067 (JEDEC) | 1067 (JEDEC) | ||||
| Maximum Transfer Speed (MHz) | DDR4-2133 | DDR4-2133 | DDR4-2133 | DDR4-2133 | ||||
| Maximum Bandwidth (MB/s) | PC4-17000 | PC4-17000 | PC4-17000 | PC4-17000 | ||||
| Memory Capacity (MB) | 8192 | 8192 | 8192 | 8192 | ||||
| Jedec Manufacture Name | Micron Technology | Micron Technology | Micron Technology | Micron Technology | ||||
| Search Amazon.com | Search! | Search! | Search! | Search! | ||||
| SPD Revision | 1.0 | 1.0 | 1.0 | 1.0 | ||||
| Registered | Yes | Yes | Yes | Yes | ||||
| ECC | Yes | Yes | Yes | Yes | ||||
| DIMM Slot # | 1 | 2 | 3 | 4 | ||||
| Manufactured | Week 18 of Year 2014 | Week 18 of Year 2014 | Week 18 of Year 2014 | Week 18 of Year 2014 | ||||
| Module Part # | 18ASF1G72PZ-2G1A2 | 18ASF1G72PZ-2G1A2 | 18ASF1G72PZ-2G1A2 | 18ASF1G72PZ-2G1A2 | ||||
| Module Revision | 0x32 | 0x32 | 0x32 | 0x32 | ||||
| Module Serial # | 0x3552DC08 | 0x3552E1B9 | 0x3552E1D2 | 0x3552E941 | ||||
| Module Manufacturing Location | 12 | 12 | 12 | 12 | ||||
| # of Row Addressing Bits | 16 | 16 | 16 | 16 | ||||
| # of Column Addressing Bits | 10 | 10 | 10 | 10 | ||||
| # of Banks | 16 | 16 | 16 | 16 | ||||
| # of Ranks | 1 | 1 | 1 | 1 | ||||
| Device Width in Bits | 4 | 4 | 4 | 4 | ||||
| Bus Width in Bits | 64 | 64 | 64 | 64 | ||||
| Module Voltage | 1.2V | 1.2V | 1.2V | 1.2V | ||||
| CAS Latencies Supported | 9 11 12 13 14 15 16 18 19 | 9 11 12 13 14 15 16 18 19 | 9 11 12 13 14 15 16 18 19 | 9 11 12 13 14 15 16 18 19 | ||||
| Timings @ Max Frequency (JEDEC) | 15-15-15-36 | 15-15-15-36 | 15-15-15-36 | 15-15-15-36 | ||||
| Maximum frequency (MHz) | 1067 | 1067 | 1067 | 1067 | ||||
| Maximum Transfer Speed (MHz) | DDR4-2133 | DDR4-2133 | DDR4-2133 | DDR4-2133 | ||||
| Maximum Bandwidth (MB/s) | PC4-17000 | PC4-17000 | PC4-17000 | PC4-17000 | ||||
| Minimum Clock Cycle Time, tCK (ns) | 0.938 | 0.938 | 0.938 | 0.938 | ||||
| Minimum CAS Latency Time, tAA (ns) | 13.500 | 13.500 | 13.500 | 13.500 | ||||
| Minimum RAS to CAS Delay, tRCD (ns) | 13.500 | 13.500 | 13.500 | 13.500 | ||||
| Minimum Row Precharge Time, tRP (ns) | 13.500 | 13.500 | 13.500 | 13.500 | ||||
| Minimum Active to Precharge Time, tRAS (ns) | 33.000 | 33.000 | 33.000 | 33.000 | ||||
| Minimum Row Active to Row Active Delay, tRRD (ns) | 3.700 | 3.700 | 3.700 | 3.700 | ||||
| Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 46.500 | 46.500 | 46.500 | 46.500 | ||||
| Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 260.000 | 260.000 | 260.000 | 260.000 | ||||
| DDR4 Specific SPD Attributes | ||||||||
| Maximum Clock Cycle Time, tCKmax (ns) | 1.500 | 1.500 | 1.500 | 1.500 | ||||
| Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC2 (ns) | 160.000 | 160.000 | 160.000 | 160.000 | ||||
| Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC4 (ns) | 110.000 | 110.000 | 110.000 | 110.000 | ||||
| Minimum Activate to Activate Delay Time different bank group, tRRD_Smin (ns) | 3.700 | 3.700 | 3.700 | 3.700 | ||||
| Minimum Activate to Activate Delay Time same bank group, tRRD_Lmin (ns) | 5.300 | 5.300 | 5.300 | 5.300 | ||||
| Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns) | 5.355 | 5.355 | 5.355 | 5.355 | ||||
| Minimum Four Activate Window Delay (ns) | 15.000 | 15.000 | 15.000 | 15.000 | ||||
| Maximum Activate Window in units of tREFI | 8192 | 8192 | 8192 | 8192 | ||||
| Thermal Sensor Present | Yes | Yes | Yes | Yes | ||||
| DRAM Stepping | 65 | 65 | 65 | 65 | ||||
| DRAM Manufacture | Micron Technology | Micron Technology | Micron Technology | Micron Technology | ||||
| SDRAM Package Type | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | ||||
| Maxium Activate Count (MAC) | Unlimited MAC | Unlimited MAC | Unlimited MAC | Unlimited MAC | ||||
| Post Package Repair Supported | No | No | No | No | ||||
| Module Type | RDIMM | RDIMM | RDIMM | RDIMM | ||||
| Module Height (mm) | 32 | 32 | 32 | 32 | ||||
| Module Thickness (front), (mm) | 2 | 2 | 2 | 2 | ||||
| Module Thickness (back), (mm) | 2 | 2 | 2 | 2 | ||||
| Reference Raw Card Used | Raw Card C Rev. 17 | Raw Card C Rev. 17 | Raw Card C Rev. 17 | Raw Card C Rev. 17 | ||||
| # of DRAM Rows | 1 | 1 | 1 | 1 | ||||
| # of Registers | 1 | 1 | 1 | 1 | ||||
| Heat Spreader Solution Present | No | No | No | No | ||||
| Register Manufacturer | IDT | IDT | IDT | IDT | ||||
| Register Revision | 30 | 30 | 30 | 30 | ||||
| Chip Select Drive Strength | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | ||||
| Command/Address Drive Strength | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | ||||
| ODT Drive Strength | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | ||||
| CKE Drive Strength | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | ||||
| Y0,Y2 Drive Strength | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | ||||
| Y1,Y3 Drive Strength | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive |
能提供一下你的硬體廠牌規格嗎?大家一起找看看問題可能在哪裡!
Windows 10 1709 下載位置?
根據你的建議, 現在嘗試進行測試: 限制audiodg.exe 使用某個或某些HT (Hyper Thread)
其實早前已懷疑是硬體問題, 已嘗試以下:
如有任何發現, 我會在這邊更新。
只是, 我想問一下, audiodg.exe 或 audioeng.dll 對 CPU 沒有要求或限制, 對吧?